Lifi communication system

ABSTRACT

A communication system includes a light source to generate light; a broadband light transmitter control electronics to modulate a light signal and provide broadband optical data transmission network using the light source; a broadband light receiver control electronics to demodulate a received light signal from the broadband optical data transmission network; and a wired network transceiver coupled to the light transmitter/receiver to receive and transmit data between the optical data transmission network and a wired circuit.

The present system relates generally to broadband lighting andcommunication system.

Traditionally, lighting has been generated using fluorescent andincandescent light bulbs. While both types of light bulbs have beenreliably used, each suffers from certain drawbacks. For instance,incandescent bulbs tend to be inefficient, using only 2-3% of theirpower to produce light, while the remaining 97-98% of their power islost as heat. Fluorescent bulbs, while more efficient than incandescentbulbs, do not produce the same warm light as that generated byincandescent bulbs. Additionally, there are health and environmentalconcerns regarding the mercury contained in fluorescent bulbs.

LED bulbs have been used in place of traditional bulbs. Compared to atraditional incandescent bulb, an LED bulb is capable of producing morelight using the same amount of power. Additionally, the operational lifeof an LED bulb is orders of magnitude longer than that of anincandescent bulb, for example, 10,000-100,000 hours as opposed to1,000-2,000 hours. However, one drawback is that an LED, being asemiconductor, generally cannot be allowed to get hotter thanapproximately 120° C. As an example, A-type LED bulbs have been limitedto very low power (i.e., less than approximately 8 W), producinginsufficient illumination for incandescent or fluorescent replacements.

Large metallic heat sink can be used but will cause the bulb to beshaped radically different from the traditionally shaped A-type formfactor bulb. Additionally, the heat sink may make it difficult for theLED bulb to fit into pre-existing fixtures. Another solution is to fillthe bulb with a thermally conductive liquid to transfer heat from theLED to the shell of the bulb. The heat may then be transferred from theshell out into the air surrounding the bulb. However, currentliquid-filled LED bulbs do not efficiently transfer heat from the LED tothe liquid. Additionally, current liquid-filled LED bulbs do not allowthe thermally conductive liquid to flow efficiently to transfer heatfrom the LED to the shell of the bulb. For example, in a conventionalLED bulb having LEDs placed at the base of the bulb structure, theliquid heated by the LEDs rises to the top of the bulb and falls as itcools. However, the liquid does not flow efficiently because the shearforce between the liquid rising up and the liquid falling down slows theconvective flow of the liquid. Another drawback of current liquid-filledLED bulbs is that they do not efficiently dissipate heat when the bulbis not positioned in an upright orientation. When a conventional LEDbulb is placed upside-down, for example, the heat-generating LEDs areflipped from the bottom of the bulb to the top of the bulb. Thisprevents an efficient convective flow within the bulb because the heatedliquid remains at the top of the bulb near the LEDs.

WIPO Patent Application WO/2012/106454 discloses an LED bulb with abase, a shell connected to the base, and a thermally conductive liquidheld within the shell. The LED bulb has a plurality of LEDs mounted onLED mounting surfaces disposed within the shell. The LED mountingsurfaces face different radial directions, and the LED mounting surfacesare configured to facilitate a passive convective flow of the thermallyconductive liquid within the LED bulb to transfer heat from the LEDs tothe shell when the LED bulb is oriented in at least three differentorientations. In a first orientation, the shell is disposed verticallyabove the base. In a second orientation, the shell is disposed on thesame horizontal plane as the base. In a third orientation, the shell isdisposed vertically below the base.

SUMMARY

A communication system includes a light source to generate light; abroadband light transmitter control electronics to modulate a lightsignal and provide broadband optical data transmission network using thelight source; a broadband light receiver control electronics todemodulate a received light signal from the broadband optical datatransmission network; and a wired network transceiver coupled to thelight transmitter/receiver to receive and transmit data between theoptical data transmission network and a wired circuit.

In another aspect, systems and methods are disclosed for making a lightsegment by forming a sealed body having an interior chamber; creating aboiling enhancement surface positioned in a predetermined location onthe interior chamber; filling the interior chamber with a liquid portionand thermally coupled to the liquid portion at all orientations of thelight blade; and boiling the liquid portion with a light source locatedon the predetermined location on an exterior portion of the sealed body.

Advantages of the bulb may include one or more of the following. Thesystem uses evaporation as a cooling mechanism. The system additionallyuses liquid cooling as a second cooling mechanism. For low wattage unit,each blade has its own cooling system, resulting in a compact andreliable system that facilitates individual replacement of blades formaintenance. For high wattage bulbs, a combination of evaporativecooling as well as liquid cooling is used to maximize heat transfer.Larger and or more power light bulbs such as 150 W equivalent bulbs and200 W equivalent bulbs can be designed as heat is efficiently removed.The bulb size can be reduced for a given wattage to be drop inreplacement in size for conventional bulbs. The bulb can efficientlytransferring heat away from the LEDs, while the bulb is in variousorientations, is desired. This is done at a far more cost effectivemanner than conventional designs. The bulb can communicate and/ortransfer data over a wired or wireless network, and the data can be userdata or can provide operational details of each bulb, down to each LED,to monitoring software for optimizing efficiency and maintenance.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1C illustrate an exemplary bulb blade in various orientations.

FIGS. 2A-2B illustrates an exemplary solid state bulb in variousorientations.

FIG. 3 shows an exemplary evaporative cooled light blade operating in aliquid cooled bulb.

FIG. 4 shows an exemplary smart building with networking connectivityfor the bulb(s).

FIG. 5 shows a microcontroller embodiment with data networking links.

DESCRIPTION

Various embodiments are described below, relating to LED bulbs. As usedherein, an “LED bulb” refers to any light-generating device (e.g., alamp) in which at least one LED is used to generate the light. Thus, asused herein, an “LED bulb” does not include a light-generating device inwhich a filament is used to generate the light, such as a conventionalincandescent light bulb. It should be recognized that the LED bulb mayhave various shapes in addition to the bulblike A-type shape of aconventional incandescent light bulb. For example, the bulb may have atubular shape, globe shape, or the like. The LED bulb of the presentdisclosure may further include any type of connector; for example, ascrew-in base, a dual-prong connector, a standard two- or three -prongwall outlet plug, bayonet base, Edison Screw base, single pin base,multiple pin base, recessed base, flanged base, grooved base, side base,or the like.

As used herein, the term “liquid” refers to a substance capable offlowing such as water. Also, the substance used as the thermallyconductive liquid is a liquid or at the liquid state within, at least,the operating ambient temperature ranges of the bulb. An exemplarytemperature range includes temperatures between −40° C. to +40° C. Also,as used herein, “passive convective flow” refers to the circulation of aliquid without the aid of a fan or other mechanical devices driving theflow of the thermally conductive liquid.

FIGS. 1A, 1B and 1C show an exemplary light blade with water cooling inthree exemplary orientations. As shown in FIG. 1A, the light blade has alight source 105 such as an LED. The light source 105 is thermallysecured to a hollow sealed body that includes a liquid portion 111 butnot completely filled up, so that a vapor or gas portion 112 remains inthe body. The volume of the liquid portion needs to be enough so that itcovers a portion of a boiling enhancement surface 117, regardless oforientation. The light source 105 generates heat during use, and theboiling enhancement surface 117 is positioned on the opposite side ofthe light source 105. The boiling enhancement 117 causes the liquidportion 111 to boil rapidly and the phase change from liquid to gasremoves heat from the light source 105. To facilitate replacement of afailed LED, the light blade has a connector 118 which can be insertedinto a corresponding connector on a base that provides power as well asadditional heat sinks to remove heat from the bulb. In one embodiment,the base contains light transceiver control electronics that enablesecure wireless data transmission network for the users as well. Suchoptical wireless transmission network control is disclosed in copendingapplication Ser. No. 13/300598 and entitled “SOLID STATE LIGHT SYSTEMWITH OPTICAL COMMUNICATION CAPABILITY” filed 20 Nov. 2011, the contentof which is incorporated by reference.

In one embodiment, the boiling enhancement surface can be done byscratching or creating indentations on the wall of the body. In anotherembodiment, the boiling enhancement surface 117 uses a coating techniquethat combines the advantages of a mixture batch type andthermally-conductive microporous structures. The microporous surface iscreated using particles of various sizes comprising any metal which canbe bonded by the soldering process including nickel, copper, aluminum,silver, iron, brass, and various alloys in conjunction with a thermallyconductive binder. A coating is applied on the surface of a substratewhile mixed with a solvent. The solvent is vaporized after theapplication prior to heating the surface sufficiently to melt the binderto bind the particles.

The boiling enhancement coating can be optimized in terms ofcavity-generating particle size to ensure no degradation in nucleateheat transfer rate and critical heat flux specification for a wideselection of liquid coolant types. This naturally translates to lowercost boiling cooler if the cheap liquid, such as water, instead ofspecially developed refrigerant or chemical fluid, can be used. Asurface containing nickel particles of sizes around 30-50 um using−100+325 mesh nickel powder mixed with solder pastes can providesuperior boiling heat transfer performance for water as the liquidcoolant.

The boiling enhancement can be a microporous coat or a boiling surfaceenhancement. In one implementation, a coating technique combines theadvantages of a mixture batch type and thermally-conductive microporousstructures. The microporous surface is created using particles ofvarious sizes comprising any metal which can be bonded by the solderingprocess including nickel, copper, aluminum, silver, iron, brass, andvarious alloys in conjunction with a thermally conductive binder. Thecoating is applied on the surface of a substrate while mixed with asolvent. The solvent is vaporized after the application prior to heatingthe surface sufficiently to melt the binder to bind the particles. Themixture batch type application is an inexpensive and easy process, notrequiring extremely high operating temperatures. The coating surfacecreated by this process is insensitive to its thickness due to highthermal conductivity of the binder. Therefore, large size cavities canbe constructed in the microporous structures for some poorly wetting butpotentially low cost fluids, such as water, without causing seriousdegradation of boiling enhancement. This makes the boiling cooler keepits high cooling efficiency for various types of liquid coolants simplyby adjusting the size of metal particles to allow the size range ofporous cavities formed fit well with the surface tension of the selectedliquid to optimize boiling heat transfer performance.

During operation, the liquid inside the light blade evaporates todissipate heat from LED. Subsequently, the coolant 150 condenses, andthe cycle is repeated to cool the LED. The first phase of the liquid 111inside the chamber of the light blade can be a liquid phase and thesecond phase can be a vapor phase. The liquid 111 can be water or anysuitable coolant. Additionally, boiling heat transfer can be done withdirect component immersion in a dielectric liquid as a means ofproviding heat transfer coefficients large enough to meet forecasteddissipation levels, while maintaining reduced component temperatures.Dielectric liquids (3M Fluorinert family) can be used because they arechemically inert and electrically non-conducting. Their use with boilingheat transfer introduces significant design challenges which includereducing the wall superheat at boiling incipience, enhancing nucleateboiling heat transfer rates, and increasing the maximum nucleate boilingheat flux (CHF). Water can also be used for low cost.

The boiling enhancement coating provides a surface enhancement whichcreates increased boiling nucleation sites, decreases the incipientsuperheats, increases the nucleate boiling heat transfer coefficient andincreases the critical heat flux. This surface enhancement isparticularly advantageous when applied to microelectronic componentssuch as LED, LED driver and other silicon chips that cannot tolerate thehigh temperature environment required to bond existing heat sinks ontothe chip, or mechanical treatments such as sandblasting, and is alsoparticularly advantageous when applied to phase change heat exchangersystems that require chemically stable, strongly bonded surfacemicrostructures. The boiling enhancement coating can be a composition ofmatter such as a glue, a solvent and cavity-generating particles. Thiscomposition is applied to a surface and then cured by low heat or othermeans, including but not limited to air drying for example, whichevaporates the solvent and causes the glue with embedded particles to bebonded to the surface. The embedded particles provide an increasednumber of boiling nucleation sites. As used herein, “paint” means asolution or suspension which is in liquid or semiliquid form and whichmay be applied to a surface and when applied, can be cured to adhere tothe surface and to form a thin layer or coat on that surface. The paintmay be applied by any means such as spread with a brush, dripped from abrush or any other instrument or sprayed, for example. Alternatively,the surface may be dipped into the paint. By curing, is meant that thesolvent will be evaporated, by exposure to the rays of a lamp, forexample and the remaining composition which includes the suspendedparticles will adhere to the surface. As used herein, “glue” means anycompound which will dissolve in an easily evaporated solvent and willbond to the particles and to the target surface. Some types of glue willbe more compatible with certain applications and all such types of suchglue will fall within the scope of the present claimed invention. Theglue to be used in the practice of the claimed invention would be anyglue which exhibits the above mentioned characteristics and which ispreferably a synthetic or naturally occurring polymer. Examples of typesof glue that could be used in the present invention include ultravioletactivated glue or an epoxy glue, for example. Epoxy glues are well knownglues which comprise reactive epoxide compounds which polymerize uponactivation. Ultraviolet glues are substances which polymerize uponexposure to ultraviolet rays. Preferably such glues would include 3M1838-L A/13 and most preferably the thermally conductive epoxiesOmegabond 101 or Omegatherm 201 (Omega Engineering, Stamford, Conn.) andthe like or any glue which would adhere to the surface and to theparticles. Another preferred glue is a brushable ceramic glue. Brushableceramic glue is a low viscosity, brushable epoxy compound. Preferredbrushable ceramic glues have a viscosity of about 28,000 cps and amaximum operating temperature of about 350.degree. F., and mostpreferred is Devcon Brushable Ceramic Glue. Thermally conductive epoxiesare those with thermal conductivities in the range of about 7 to about15 BTU/(ft.sup.2) (sec) (.degree.F./in). The particles of the presentinvention may be any particles which would generate cavities on thesurface in the manner disclosed herein. As used herein,“cavity-generating particles” means particles which when applied to asurface, or when fixed in a thin film on a surface, form depressions inthe surface of from about 0.5 um to about 10 um in width, whichdepressions are suitable for promoting boiling nucleation. Preferredparticles disclosed herein include crystals, flakes and randomly shapedparticles, but could also include spheres or any other shaped particlewhich would provide the equivalent cavities. The particles are also notlimited by composition. Such particles could comprise a compound such asan organic or inorganic compound, a metal, an alloy, a ceramic orcombinations of any of these. One consideration is that for certainapplications, the particles should be electrically non-conducting. Somepreferred particles might comprise silver, iron, copper, diamond,aluminum, ceramic, or an alloy such as brass and particularly preferredparticles are silver flakes or, for microelectronic applications,diamond particles, copper particles or aluminum.

In one embodiment, a boiling enhancement composition can includesolvent, glue and cavity-generating particles in a ratio of about 10 mlsolvent to about 0.1 ml of glue to from about 0.2 grams to about 1.5grams of cavity-generating particles. Alternatively, the preferredcomposition is in a ratio of about 10 ml solvent to 0.1 ml of glue toabout 1.5 grams of cavity-generating particles. It is understood thatcompositions of different ratios will be applicable to differentutilities and that the ratios disclosed herein are not limiting in anyway to the scope of the claimed invention. For example, an embodiment ofthe present invention is a composition of matter comprising solvent,glue and cavity-generating particles wherein the composition is 85-98%(v/v) solvent, 0.5-2% (v/v) glue and 1.5-15% (w/v) cavity-generatingparticles. By % (v/v) is meant liquid volume of component divided bytotal volume of suspension. By % (w/v) is meant grams of componentdivided by 100 ml of suspension.

The boiling enhancement composition may be added to the surface in anymanner appropriate to the particular application. For example, thecomposition may be painted or dripped onto the surface, or even sprayedonto the surface. Alternatively, the surface or object may be dippedinto the composition of the present invention. Following any of theseapplications, the enhancing composition would then be cured. It iscontemplated that the composition of the present invention may also beincorporated into the surface as it is being manufactured and theboiling heat transfer enhancement would be an integral part of thesurface. More details on the boiling enhancement coating is described inU.S. Pat. No. 5,814,392, the content of which is incorporated byreference.

Non-Dielectric liquid coolant such as water is preferred due to low costand low environmental issues. Dielectric liquid coolants can also beused. Aromatics coolant such as synthetic hydrocarbons of aromaticchemistry (i.e., diethyl benzene [DEB], dibenzyl toluene, diary) alkyl,partially hydrogenated terphenyl) can be used. Silicate-ester such asCoolanol 25R can be used. Aliphatic hydrocarbons of paraffinic andiso-paraffinic type (including mineral oils) can be used as well.Another class of coolant chemistry is dimethyl- and methyl phenyl-poly(siloxane) or commonly known as silicone oil—since this is a syntheticpolymeric compound, the molecular weight as well as the thermo-physicalproperties (freezing point and viscosity) can be adjusted by varying thechain length. Silicone fluids are used at temperatures as low as −100°C. and as high as 400° C. These fluids have excellent service life inclosed systems in the absence of oxygen. Also, with essentially no odor,the non-toxic silicone fluids are known to be workplace friendly.However, low surface tension gives these fluids the tendency to leakaround pipe-fittings, although the low surface tension improves thewetting property. Fluorinated compounds such as perfluorocarbons (i.e.,FC-72, FC-77) hydrofluoroethers (HFE) and perfluorocarbon ethers (PFE)have certain unique properties and can be used in contact with theelectronics.

Non-dielectric liquid coolants offer attractive thermal properties, ascompared with the dielectric coolants. Non-dielectric coolants arenormally water-based solutions. Therefore, they possess a very highspecific heat and thermal conductivity. De-ionized water is a goodexample of a widely used electronics coolant. Other popularnon-dielectric coolant chemistries include Ethylene Glycol (EG),Propylene Glycol (PG), Methanol/Water, Ethanol/Water, Calcium ChlorideSolution, and Potassium Formate/Acetate Solution, among others.

In another embodiment the body-shell can be made of plastic and furthercan be molded into a relatively complex structure with asymmetric shapeor small detailed features, which is usually much more expensive, if notimpossible, to be manufactured using metal. The boiling cooler alsocomprises a boiling enhancement surface on a thermally conductive sideshell, and partially filled liquid coolant. Vapor generated from boilinghelps spread heat over all extended space adding extra pathway forcooling through convection. In some cases, the electric circuit moduleboards and/or power supply, on which many electric or photoniccomponents/devices are tightly packed, have very stringent requirementsin the mechanical design for the associated or integrated coolers. Usingplastic material for the body-shell of the bulb can easily make the bulbcooler in complex shape or specific dimension without worry aboutassociated costs. In other system applications such as those of FIG. 3,forced air cooling may be not available, making the traditional heatsink impossible to handle the ever-increasing heat flux out of thoseelectronics system. The cooler utilizing boiling enhancement surfaceachieves efficient cooling within the vessel, making the forced airconvection not critical for the system. In addition, natural orforced-air convection can still provide extra heat exchange through theextended exterior surface of the vessel of this boiling cooler.

The body-shell for the light segment or light blade can be made ofless-expensive materials comprising plastic, vinyl, paper, or molded andbaked copper powder, which is sealed with side to form an enclosedvessel holding partially filled liquid coolant. The shape of thebody-shell is intentionally made to have an extended surface area forextra benefit of convection cooling. Although the shape of thebody-shell is relatively irregular it can be done easily andinexpensively because of the material selection such as plastic.

The column can have one or more extrusions or posts each having theboiling enhancement surface in combination with the liquid coolant andat least a portion of the boiling enhancement surface contacts theliquid and evaporation occurs regardless of the orientation of thevessel. The extended heat conducting structure can also be a pyramid.The extended heat structure can be a sloped surface, wherein the slopedsurface is higher toward a center of the structure and lower toward anedge of the structure. The surfaces may have other features such asgrooves or bumps to facilitate escaping of bubbles forming on thesurfaces and to increase the contact area between the surface and theliquid. The liquid forms bubbles formed on the surface of the coatingand wherein the bubble escapes toward the top. The body-shell of thevessel can have one or more extended plate and one or more extrudedfins. The body-shell of the vessel can at least partially comprises oneor more of: metal, plastic, vinyl, paper, molded and baked copperpowder, electrically insulating and/or thermally conductive plastic. Theboiling enhancement surface coupled to the thermally conductive side ona surface within the vessel is at least partially submerged in theliquid coolant. The boiling enhancement surface comprises a microporoussurface structure insensitive to coating thickness, formed by combininga mixed cavity-generating particle batch and a thermal conductivebinder. The binder can be solder, silver, gold, metal binder, non-metalbinder, or epoxy. The liquid coolant comprises water. The liquid coolantcomprises one of: a dielectric liquid, a non-dielectric liquid.

FIGS. 2A and 2B illustrate a perspective view and a cross-sectionalview, respectively, of exemplary LED bulb 100. LED bulb 100 includes abase 112 and a shell 101 encasing the various components of LED bulb100. For convenience, all examples provided in the present disclosuredescribe and show LED bulb 100 being a standard A-type form factor bulb.However, as mentioned above, it should be appreciated that the presentdisclosure may be applied to LED bulbs having any shape, such as atubular bulb, globe-shaped bulb, or the like.

Shell 101 may be made from any transparent or translucent material suchas plastic, glass, polycarbonate, or the like. Shell 101 may includedispersion material spread throughout the shell to disperse lightgenerated by LEDs 103. The dispersion material prevents LED bulb 100from appearing to have one or more point sources of light. LED bulb 100includes a plurality of LEDs 103 connected to LED mounts 107, which aredisposed within shell 101. LED mounts 107 may be made of any thermallyconductive material, such as aluminum, copper, brass, magnesium, zinc,or the like. Since LED mounts 107 are formed of a thermally conductivematerial, heat generated by LEDs 103 may be conductively transferred toLED mounts 107. Thus, LED mounts 107 may act as heat-sinks for LEDs 103.

In the present exemplary embodiment, thermal bed 105 is inserted betweenan LED 103 and an LED mount 107 to improve heat transfer between the twocomponents. Thermal bed 105 may be made of any thermally conductivematerial, such as aluminum, copper, thermal paste, thermal adhesive, orthe like. Thermal bed 105 may have a higher thermal conductivity thanLED mount 107. For example, LED mount 107 may be formed of aluminum andthermal bed 105 may be formed of copper. It should be recognized,however, that thermal bed 105 may be omitted, and LED mount 107 can bedirectly connected to LEDs 103.

In one exemplary embodiment, LED mounts 107 are finger-shapedprojections with a channel 109 formed between pairs of LED mounts 107.One advantage of such a configuration is increased heat dissipation dueto the large surface-area-to-volume ratio of LED mounts 107. It shouldbe recognized that LED mounts 107 may have various shapes other thanthat depicted in FIG. 1A in order to be finger-shaped projections. Forexample, LED mounts 107 may be straight posts with a channel formedbetween pairs of posts.

The top portions of LED mounts 107 may be angled or tapered at an angle119, which is measured relative to a vertical line when LED bulb 100 isin a vertical position. Exemplary angle 119 includes a range of −35° to90°. Also, all the top portions of LED mounts 107 can be angled ortapered at the same angle, such as 9° or 15°. Alternatively, acombination of angles can be used, such as half at 18° and half at 30°,or half at 9° and half at 31°. As will be described in greater detailbelow with respect to FIGS. 2A-2C, the angled top portions of LED mounts107 may facilitate the passive convective flow of liquids within LEDbulb 100.

LEDs 103 are connected to portions of LED mounts 107, which serve asmounting surfaces for LEDs 103, that are angled or tapered at an angle121, which is measured relative to a vertical line when LED bulb 100 isin a vertical position. Exemplary angle 121 includes a range of −35° to90°. Also, the portions of LED mounts 107 to which LEDs 103 areconnected can be angled or tapered at the same angle, such as 9° or 15°.Alternatively, a combination of angles can be used, such as half at 18°and half at 30°, or half at 9° and half at 31°. The particular angle orangles may be selected to create a desirable photometric distribution.

In one embodiment, as depicted in FIG. 2B, the angled or taperedportions on which LEDs 103 are connected (the mounting surfaces) areseparate from the top portions of LED mounts 107, which are also angledor tapered. It should be recognized, however, that LEDs 103 can beconnected on the top portions of LED mounts 107, which are angled ortapered.

Turning now to FIG. 3, a combination LED bulb is shown. In thisembodiment, in addition to each light blade being cooled by evaporativeheat transfer, the bulb is also cooled by an electrically non-conductiveor inert material, but thermally conductive fluid such as mineral oil.This embodiment of a light emitting diode (LED) bulb has a base toreceive one or more light blades, each light blade including: a sealedbody having an interior chamber with a liquid portion and a vapor or gasportion; a boiling enhancement surface positioned in a predeterminedlocation on the interior chamber and thermally coupled to the liquidportion at all orientations of the light blade; an LED thermally coupledto the predetermined location on an exterior portion of the sealed body;and an LED mounting surface, wherein the LED is mounted to the LEDmounting surface, wherein the LED mounting surface faces differentradial directions, and wherein the LED mounting surface provides apassive convective flow of the thermally conductive liquid within theLED bulb. A shell is connected to the base; and a thermally conductiveliquid held within the shell. Inside the chamber of each light segmentor light blade, the liquid can be conductive or non-conductive, however,outside the chamber, the LEDs are immersed in a thermally conductive butelectrically inert liquid. Thus, two levels of cooling are provided: anevaporative cooling system occurs inside the chamber of each light bladeor segment and a liquid cooled system outside the chamber.

The LED bulb 100 is filled with thermally conductive liquid 111A fortransferring heat generated by LEDs 103 to shell 101. Thermallyconductive liquid 111A may be any thermally conductive liquid, mineraloil, silicone oil, glycols (PAGs), fluorocarbons, or other materialcapable of flowing. It may be desirable to have the liquid chosen be anon-corrosive dielectric. Selecting such a liquid can reduce thelikelihood that the liquid will cause electrical shorts and reducedamage done to the components of LED bulb 100.

In the present embodiment, base 112 of LED bulb 100 includes aheat-spreader base 113. Heat-spreader base 113 may be made of anythermally conductive material, such as aluminum, copper, brass,magnesium, zinc, or the like. Heat-spreader base 113 may be thermallycoupled to one or more of shell 101, LED mounts 107, and thermallyconductive liquid 111A. This allows some of the heat generated by LEDs103 to be conducted to and dissipated by heat-spreader base 113.

The size and shape of LED mounts 107 may affect the amount of heatconducted to conductive liquid 111 and heat-spreader base 113. Forexample, when LED mounts 107 are formed to have a largesurface-area-to-volume ratio, a large percentage of the total heat inLED mounts 107 may be conducted from LED mounts 107 to conductive liquid111, while a small percentage of the total heat in LED mounts 107 may beconducted from LED mounts 107 to heat-spreader base 113. Where LEDmounts 107 have a smaller surface-area-to-volume ratio, a smallpercentage of the total heat in LED mounts 107 may be conducted from LEDmounts 107 to conductive liquid 111, while a large percentage of thetotal heat in LED mounts 107 may be conducted from LED mounts 107 toheat-spreader base 113.

In this embodiment, base 112 of LED bulb 100 includes a connector base115 for connecting the bulb to a lighting fixture. Connector base 115may be a conventional light bulb base having threads 117 for insertioninto a conventional light socket. However, it should be appreciated thatconnector base 115 may be any type of connector, such as a screw-inbase, a dual-prong connector, a standard two- or three-prong wall outletplug, bayonet base, Edison Screw base, single pin base, multiple pinbase, recessed base, flanged base, grooved base, side base, or the like.

During operation of one example where the LED bulb 100 points upward,the LED becomes hot and the liquid inside the chamber boil and coolsdown the light blade individually. Outside of the light blade, theliquid at the center of LED bulb 100 also rises towards the top of shell101. This is due to the heat generated by LEDs 103 and conductivelytransferred to thermally conductive liquid 111 via LEDs 103 and LEDmounts 107. As thermally conductive liquid 111A is heated, its densitydecreases relative to the surrounding liquid, thereby causing the heatedliquid to rise to the top of shell 101.

As described above with respect to FIG. 1A, LED mounts 107 may beseparated by channels 109. Separating LED mounts 107 with channels 109not only increases the surface-area-to-volume ratio of LED mounts 107,but also facilitates an efficient passive convective flow of thermallyconductive liquid 111A by allowing the flow of thermally conductiveliquid 111A there between. For example, since the liquid along thesurfaces of LED mounts 107 is heated faster than the surrounding liquid,an upward flow of thermally conductive liquid 111 is generated aroundLED mounts 107 and within channels 109. In one example, channels 109 maybe shaped to form vertical channels pointing towards the top of shell101. As a result, thermally conductive liquid 111 may be guided alongthe edges of channel 109 towards the top and center of shell 101.

Once the heated, thermally conductive liquid 111A reaches the topportion of shell 101, heat is conductively transferred to shell 101,causing thermally conductive liquid 111 to cool. As thermally conductiveliquid 111A cools, its density increases, thereby causing thermallyconductive liquid 111A to fall. In one example, as discussed above, thetop portions of LED mounts 107 may be angled. The sloped surfaces of LEDmounts 107 may direct the flow of the cooled, thermally conductiveliquid 111A outwards and down the side surface of shell 101. By doingso, thermally conductive liquid 111A remains in contact with shell 101for a greater period of time, allowing more heat to be conductivelytransferred to shell 101. In addition, since the downward flow ofthermally conductive liquid 111A is concentrated along the surface ofshell 101, the shear force between the upward flowing liquid at thecenter of LED bulb 100 and the downward flowing liquid along the surfaceof shell 101 is reduced, thereby increasing the convective flow ofthermally conductive liquid 111A within LED bulb 100.

Once reaching the bottom of shell 101, thermally conductive liquid 111Aflows inwards toward LED mounts 107 and rises as heat generated by LEDs103 heats up the liquid. The heated, thermally conductive liquid 111 isagain guided through channels 109 as described above. The describedconvective cycle continuously repeats during operation of LED bulb 100to cool LEDs 103. It should be appreciated that the convective flowdescribed above represents the general flow of liquid within shell 101.One of ordinary skill in the art will recognize that some of thermallyconductive liquid 111A may not reach the top and bottom of shell 101before being cooled or heated sufficiently to cause the liquid to fallor rise.

Shell 101 and LED mounts 107 may be formed into a circle any otherdesired shape. The LED mounting surfaces face different radialdirections. As a result of LED mounts 107 conforming to the shape ofshell 101, the outer side surfaces of LED mounts 107 may guide the flowof the cooled, thermally conductive liquid 111 down the side surfaces ofshell 101. By doing so, thermally conductive liquid 111A remains incontact with shell 101 for a greater period of time, allowing more heatto be conductively transferred to shell 101. Since the downward flow ofthermally conductive liquid 111A is concentrated on the outer surface ofshell 101, the shear force between the upward flowing liquid at thecenter of LED bulb 100 and the downward flowing liquid along the surfaceof shell 101 is reduced, thereby increasing the convective flow ofthermally conductive liquid 111A within LED bulb 100.

Once reaching the bottom of shell 101, thermally conductive liquid 111Aflows towards LED mounts 107 and rises as heat generated by LEDs 103heats up the liquid. The heated thermally conductive liquid 111A isagain guided through channels 109 as described above. The describedconvective cycle continuously repeats during operation of LED bulb 100to cool LEDs 103. It should be appreciated that the convective flowdescribed above represents the general flow of liquid within shell 101.One of ordinary skill in the art will recognize that some of thermallyconductive liquid 111A may not reach the top and bottom of shell 101before being cooled or heated sufficiently to cause the liquid to fallor rise.

LED mounts 107 may be separated by channels 109. Separating LED mounts107 with channels 109 not only increases the surface-area-to-volumeratio of LED mounts 107, but may also facilitate an efficient passiveconvective flow of thermally conductive liquid 111A by directing theflow of thermally conductive liquid 111A. For example, since the liquidalong the surfaces of LED mounts 107 is heated faster than thesurrounding liquid, an upward flow of thermally conductive liquid 111Ais generated around LED mounts 107 and within channels 109. In oneexample, channels 109 may be shaped to form vertical channels pointingtowards the bottom (previously top) of shell 101. As a result, thermallyconductive liquid 111A may be guided along the vertical edges of channel109 towards the top (previously bottom) of shell 101.

In another example configuration, once the heated, thermally conductiveliquid 111A reaches the top (previously bottom) portion of shell 101,heat is conductively transferred to shell 101, causing thermallyconductive liquid 111A to cool. As thermally conductive liquid 111Acools, its density increases, thereby causing thermally conductiveliquid 111A to fall. Since the heated, thermally conductive liquid 111Ais forced up and outwards in an upside-down vertical orientation, thecooled, thermally conductive liquid 111A falls down the sides of shell101. This allows thermally conductive liquid 111A to remain in contactwith shell 101 for a greater period of time, allowing more heat to beconductively transferred to shell 101. In addition, since the downwardflow of thermally conductive liquid 111A is concentrated along thesurface of shell 101, the shear force between the upward flowing liquidat the center of LED bulb 100 and the downward flowing liquid along thesurface of shell 101 is reduced, thereby increasing the convective flowof thermally conductive liquid 111A within LED bulb 100.

Once reaching the bottom (previously top) of shell 101, thermallyconductive liquid 111A may move towards the center of LED bulb 100 andrise as heat generated by LEDs 103 heats up the liquid. In one example,as illustrated by FIGS. 1A-1B and FIGS. 2A-2C, the bottom (previouslytop) portions of LED mounts 107 may be angled inwards towards the centerof LED bulb 100. The sloped surface of LED mount 107 may direct the flowof the heated, thermally conductive liquid 111A outwards and upwards tothe top (previously bottom) portion of shell 101, as illustrated by FIG.2C. The heated, thermally conductive liquid 111A may be further guidedthrough channels 109 towards the top (previously bottom) portion ofshell 101. The described convective cycle continuously repeats duringoperation of LED bulb 100 to cool LEDs 103. It should be appreciatedthat the convective flow described above represents the general flow ofliquid within shell 101. One of ordinary skill in the art will recognizethat some of thermally conductive liquid 111A may not reach the top andbottom of shell 101 before being cooled or heated sufficiently to causethe liquid to fall or rise.

A passive convective flow of thermally conductive liquid 111A throughoutshell 101 is improved by the inclusion of the central structurecomprising LED mounts 107. Providing LEDs 103 on LED mounts 107 near thecenter of shell 101 avoids the situation described above with respect toa conventional LED bulb where the heat-generating elements (LEDs) arepositioned at the top of the bulb.

As shown in FIG. 4, a smart building system for use in a building caninclude a heater & transceiver 10, an HVAC system with transceiver 12, alight fixture 14, an LED-based light 16, a controller 18A. Thecontroller 18A communicates with one or more light relays or repeaters20. The HVAC system 12 can include known HVAC components, such as aheater, an air conditioner, fans, a thermostat, and ductwork. The HVACsystem 12 can regulate the temperature, humidity, and/or other airquality considerations in one or more rooms of the building. Forexample, the HVAC system 12 can maintain the temperature in one or morerooms of the building at a level near a setpoint temperature input tothe thermostat. The HVAC system 12 can also be capable of controllingairflow between the building and the environment surrounding thebuilding, such as by opening or closing vents, windows, skylights, andother barriers between the building and the surrounding environment. Inaddition or alternative to the HVAC system 12, the smart building system10 can include another type of temperature control system (e.g., acontrol for heated floors), another type of light control system (e.g.,a control for window shades or dynamically tinted windows), or someother control for the building. The HVAC system 12 can be incommunication with the controller 18 as is described below in greaterdetail.

The light fixture 14 can be designed to accept standard fluorescenttubes, such as a T-5, T-8, or T-12 fluorescent tube, or other standardsized light, such as incandescent bulbs. Alternatively, the fixture 14can be designed to accept non-standard sized lights, such as lightsinstalled by an electrician. Additionally, the fixture 14 can includeone or more fixtures. The fixture 14 can be in communication with thecontroller 18 for controlling the operation of the light 16 as isdescribed below.

FIG. 5 illustrates by block diagram an electrical schematic of acommunications network. Incoming/Outgoing BPL communication 3201 isprovided through a wire from a remote BPL transceiver. This is theshared electrical circuit. A Broadband-over-Power-Line (BPL) transceiver3202 is provided to receive and transmit data from/to the BPL enabledelectrical circuit. The particular interface implemented may vary.Currently a number of existing interfaces could be used, such asUniversal Serial Bus (USB), Ethernet, Media Independent Interface (MII),etc, and the particular choice of interface could further depend on theBPL transceiver used, as will be apparent to those skilled in the art.

A micro-controller, microprocessor, ASIC or the like 3203 is providedfor program control that can transmit/receive data to/from BPLcommunication network 3201 through BPL transceiver 3202. Microprocessor3203 in an embodiment may respond to commands received on this network3201 to manipulate enable circuitry 3204, and may also issue commands orsend data to network 3201 if needed. If the transmit portion of enablecircuitry 3204 is enabled, these commands/data will also be passed tothe optical link.

Enable circuitry 3204, through driver circuitry 3205, may in oneembodiment be enabled to turn on or off the LED optical transmitters3102, 3104, as well as change the characteristics of the light, such asbrightness and even color mix when multicolor LEDs are used. This isuseful for things such as an annunciator light or emergency light, whichmay provide a visual indicator for things such as tornado, lock-down,fire, movement, etc. Enable circuitry 3204 may also manipulate theability for BPL communication network 3201 to send and/or receive dataat this clock to or from the optical link.

Driver circuitry 3205 and LED(s) 3206 will pass any signals to theoptical link for other devices. Driver circuitry 3205 may, in thepreferred embodiment, simply be appropriate buffering, isolation,modulation or amplification circuitry which will provide appropriatevoltage and power to adequately drive LED emitter 3206 into producing avisible light transmission. Exemplary of common driver circuits areoperational amplifiers (Op-amps) and transistor amplifiers, though thoseskilled in the art of signal conditioning will recognize many optionalcircuits and components which might optionally be used in conjunctionwith the present invention. Also, it may be desirable to use amodulation scheme with the signal. The transmit circuitry may have toprovide a means of modulation in this case, also preferably incorporatedinto driver circuitry 3205. The type of modulation will be decided usingknown considerations at the time of design, selected for exemplarypurposes from FM, AM, PPM, PDM, PWM, OFDM, and QAM.

Similar to but preferably complementary with the transmission circuitry,receiver circuitry 3207 receives data from the optical link detected byphoto sensor 3208. Receiver circuitry 3207 will appropriately condition,and may further convert a data-bearing electrical signal. As but oneexample of such conversion, receiver circuitry 3207 may additionallydemodulate a data-bearing electrical signal, if the data stream has beenmodulated by an optical host. Suitable buffering, amplification andother conditioning may be provided to yield a received data signal.

In one embodiment, LED 3206 may be illuminated as a night light at lowpower. Where properly enabled with battery back-up or the like, thepreferred embodiment communications such as illustrated in the Figuresmay further provide communications and emergency lighting in the eventof a power failure.

In an embodiment of the invention, an intelligent audio/visualobservation and identification database system may also be coupled tosensors as disposed about a building, relying upon the presentcommunications system transmitting over the synchronization wire of aclock system. The system may then build a database with respect totemperature sensors within specific locations, pressure sensors, motiondetectors, communications badges, phone number identifiers, soundtransducers, and/or smoke or fire detectors. Recorded data as receivedfrom various sensors may be used to build a database for normalparameters and environmental conditions for specific zones of astructure for individual periods of time and dates. A computer maycontinuously receive readings/data from remote sensors for comparison tothe pre-stored or learned data to identify discrepancies therebetween.In addition, filtering, flagging and threshold procedures may beimplemented to indicate a threshold discrepancy to signal an officer toinitiate an investigation. The reassignment of priorities and thestorage and recognition of the assigned priorities occurs at thecomputer to automatically recalibrate the assignment of points or flagsfor further comparison to a profile prior to the triggering of a signalrepresentative of a threshold discrepancy.

The intelligent audio/visual observation and identification databasesystem may also be coupled to various infrared or ultraviolet sensors,in addition to the optical sensors incorporated directly into LEDoptical transmitters and optical detectors, and used forsecurity/surveillance within a structure to assist in the earlyidentification of an unauthorized individual within a security zone orthe presence of an intruder without knowledge of the intruder.

The intelligent audio/visual observation and identification databasesystem as coupled to sensors and/or building control systems for abuilding which may be based upon audio, temperature, motion, pressure,phone number identifiers, smoke detectors, fire detectors and firealarms is based upon automatic storage, retrieval and comparison ofobserved/measured data to prerecorded data, in further comparison to thethreshold profile parameters to automatically generate a signal to asurveillance, security, or law enforcement officer.

The optical link does not interfere with existing communication systemslike those that are common today. Consequently, the preferred embodimentmay be used in a variety of applications where prior art systems weresimply unable due to EMI/RFI considerations.

Set-up, testing, troubleshooting and the like are also vastlysimplified. When the light communication system is working, the user canactually see the illumination. If an object interferes with lighttransmission, the user will again immediately recognize the same. Thus,the ease and convenience of this light system adds up to greatermobility and less cost. In addition, relatively high energy outputs maybe provided where desired using the preferred visible lightcommunications channel, since the human eye is adapted andwell-protected against damage from light. In contrast, many invisibletransmission techniques such as Ultraviolet (UV) or Infra-Red (IR)systems have much potential for harm.

A host lamp fixture system may replace stationary (mounted in aparticular place) lighting fixtures in order to communicate data. Insideof LED lights there may be one or many dies; these may pulsate onslightly different frequencies from a single light to communicate. Eachmay be looking for changes by way of Multiple Channel Access or othersuitable technique.

The LED signal light can provide systematic information transfer throughencrypted pulsed light (hereinafter SIT-TEL) communication system whichmay be depicted in several embodiments. Any reference to a SIT-TELcommunication herein is perceived to be equivalent to, and/or the sameas, a general reference to pulsed light communication. In general, thesignal light and SIT-TEL pulsed light communication system may be formedof a single row, single source, or an array of light emitting diodelight sources configured on a light support and in electricalcommunication with a controller and a power supply, battery, or otherelectrical source. The signal light and SIT-TEL pulsed lightcommunication system may provide various light signals, colored lightsignals, or combination or patterns of light signals for use inassociation with the communication of information. These light signalsmay also be encoded. Additionally, the signal light and SIT-TEL pulsedlight communication system may be capable of displaying symbols,characters, or arrows. Rotating and oscillating light signals may beproduced by sequentially illuminating columns of LEDs on a stationarylight support in combination with the provision of variable lightintensity from the controller. However, the signal light and SIT-TELpulsed light communication system may also be rotated or oscillated viamechanical means. The signal light and SIT-TEL pulsed lightcommunication system may also be easily transportable and may beconveniently connected to a stand such as a tripod for electricalcoupling to a power supply, battery, or other electrical source as aremote stand-alone signaling or communication device.

The signal light and SIT-TEL pulsed light communication system may beelectrically coupled to a controller used to modulate, pulse, or encode,the light generated from the light sources to provide for variouspatterns or types of illumination to transmit messages.

Individual light supports as a portion of the SIT-TEL communicationsystem may be positioned adjacent to, and/or be in electricalcommunication with another light support, through the use of suitableelectrical connections. Alternatively, individual light supports may bein communication with each other exclusively through the transmissionand receipt of pulsed light signals.

A plurality of light supports or solitary light sources may beelectrically coupled in either a parallel or series manner to acontroller. The controller is also preferably in electricalcommunication with the power supply and the LEDs, to regulate ormodulate the light intensity for the LED light sources. The individualLEDs and/or arrays of LEDs may be used for transmission of communicationpackets formed of light signals.

The controller for the LED light support may generate and/or recognizepulsed light signals used to communicate information. The LED lightsystem may also include a receptor coupled to the controller, where thereceptor is constructed and arranged for receipt of pulsed LED lightsignals for conversion to digital information, and for transfer of thedigital information to the controller for analysis and interpretation.The controller may then issue a light signal or other communicationsignal to an individual to communicate the content of receivedinformation transmitted via a pulsed LED light carrier.

In one communications application, two unsynchronized transceiversphase-lock to each other and exchange pulse-width-modulated databi-directionally. In this protocol, the two receivers take turns tooperate in transmit and receive mode, and a relatively short light pulseindicates a 0 or space state, and a relatively long light pulseindicates a 1 or mark state. This protocol starts in an idle cycle withthe transceiver performing an idling cycle. In the idle cycle, thetransceiver transmits a one millisecond light pulse followed by a fourmillisecond receive period. During the receive period, the transceiverexecutes multiple light measurements. These light measurements provideonly a one bit of resolution, i.e., whether the incoming light flux isabove or below a predetermined threshold, nominally about 1.5V. Theidling cycle continues until at least two measurement times insuccession indicate “light seen.” At this point, the transceiver assumesan incoming pulse of light from another transceiver has been detected,and shifts from the idling loop to a slightly faster synchronizing loop.During the synchronizing loop, the transmitted light pulse is still onemillisecond ON, but followed by a variable number of light measurements.When in the synchronizing loop, the microprocessor terminates themeasurement set after either a predetermined number of measurements, orwhen the trailing edge of a light pulse is detected. A trailing edge isconsidered to be found when a pair of back-to-back measurements bothindicate “light seen” followed by ten measurements without “light seen.”The execution pattern inside the synchronize loop is therefore composedof one transceiver's LED on for one millisecond, then a one millisecondperiod with both LEDs off, followed by the other transceiver's LED onfor one millisecond, and finally both LEDs off for one millisecond. Evenif the transceivers have clock frequency errors of up to 25%, they willstill be able to synchronize. The nominal synchronize loop pulse rate is250 Hz, with a 25% duty cycle. During communication, data bits aretransmitted in asynchronous form. For example, a one millisecond lightpulse, indicates a MARK and a 0.5 millisecond light pulse indicates aSPACE. The system normally idles with MARK bits being transmitted. Here,the operation of the data transfer loop is the same as the synchronizeloop. During data transmission, the format is at least 16 MARK bits toallow synchronization, then a single SPACE as a start bit, followed byeight bits of data, followed by one MARK as a stop bit. This is similarto the common 8-N-1 RS-232 format. To decode the light pulses, thereceiving transceiver keeps a count of “light seen” measurements foreach execution of the synchronize loop. If seven or fewer light-seenmeasurements are counted, then a SPACE is recorded; if eight or morepulses are counted, then a MARK is recorded. The usual asynchronousdeframing, i.e., dropping the leading SPACE start bit and the trailingMARK stop bit, can be performed. The resulting 8-bit data word is thenavailable to the application-level program. Simple data communicationscan also be combined with error correction and encryption. Other opticalcommunications protocols are also possible.

In some applications, the peer-to-peer ability to transfer informationor authorization is desirable. In other applications, such as financialand other secure transactions, authentication is as important as thedata transfer itself, and the uncontrolled passing of authority must beprevented. An unfortunate side effect of the programmable nature of thetransceiver is that there is no guarantee that another transceiver willrespect any “do not forward” data tags that may be inserted by anapplication. Non-transferable authorization and unforgeableproof-of-identity are difficult problems with many subtleties. However,simple cryptography is possible and can be used to keep the transceiverstransactions secure from eavesdropping and spoofing. The microprocessorused has sufficient power to implement common symmetric cryptographicalgorithms. These require the transmitter and receiver to share a secretkey so communication between any two transceivers is configured inadvance. The transceiver can be equipped with sufficient memory to holdmany symmetric encryption keys and can therefore be set up tocommunicate with a large number of other transceivers. Zero-knowledgeproofs (ZKP) and public-key (or asymmetric) cryptography enable thetransceiver to securely prove its identity and communicate with anytransceiver that had access to published information, see Schneier, “Applied Cryptography,” 2nd edition, John Wiley and Sons, New York, N.Y.,1996, pp. 101-111. No shared secrets are necessary.

In one embodiment, each LED in the bulb can have a different color thatwhen combine, can have any color desired. The color of the bulb can bespecified using a computer or mobile device such as a phone, or can beprogrammed in advance depending to the mood of the user as sensed bysensors in the house or sensed from messages and emails recentlyreceived by the user.

Although a feature may appear to be described in connection with aparticular embodiment, one skilled in the art would recognize thatvarious features of the described embodiments may be combined. Moreover,aspects described in connection with an embodiment may stand alone.

The following description is presented to enable a person of ordinaryskill in the art to make and use the various embodiments. Descriptionsof specific devices, techniques, and applications are provided only asexamples. Various modifications to the examples described herein will bereadily apparent to those of ordinary skill in the art, and the generalprinciples defined herein may be applied to other examples andapplications without departing from the spirit and scope of the variousembodiments. Thus, the various embodiments are not intended to belimited to the examples described herein and shown, but are to beaccorded the scope consistent with the claims.

What is claimed is:
 1. A communication system, comprising: a lightsource to generate light; a broadband light transmitter controlelectronics to modulate a light signal and provide broadband opticaldata transmission network using the light source; a broadband lightreceiver control electronics to demodulate a received light signal fromthe broadband optical data transmission network; and a wired networktransceiver coupled to the light transmitter/receiver to receive andtransmit data between the optical data transmission network and a wiredcircuit.
 2. The system of claim 1, comprising a light connector fittinga T-5, T-8, or T-12 fluorescent tube or a light connector fitting anincandescent bulb, wherein the connector provides data communication andoperation of the light source.
 3. The system of claim 1, comprising aHVAC (heating, ventilating, and air conditioning) system coupled to anoptical transceiver to communicate operation data over the broadbandoptical data transmission network.
 4. The system of claim 1, wherein thewired circuit comprises at least a Broadband-over-Power-Line (BPL)transceiver.
 5. The system of claim 1, comprising an observation andidentification database optically coupled to sensors disposed about abuilding, the database communicating with temperature sensors withinspecific locations, pressure sensors, motion detectors, communicationsbadges, phone number identifiers, sound transducers, and fire detectors.6. The system of claim 5, wherein the database captures parameters andenvironmental conditions for specific zones of a structure forindividual periods of time and dates and wherein a processor receivesdata from remote sensors for comparison to learned data to identifydiscrepancies.
 7. The system of claim 6, comprising security orsurveillance module within a structure for identification of anunauthorized individual within a security zone.
 8. The system of claim1, comprising a pulsed light controller coupled to the light source, the9. The system of claim 8, comprising an encryption module coupled to thepulsed light controller to provide secure broadband communication. 10.The system of claim 1, wherein the pulsed light controller generatesrotating and oscillating light signals sequentially illuminating columnsof LEDs on a stationary light support with a variable light intensity orwith a motor.
 11. The system of claim 1, comprising a bulb, including: asealed body having an interior chamber with a liquid portion and a vaporor gas portion; a boiling enhancement surface positioned in apredetermined location on the interior chamber and thermally coupled tothe liquid portion at all orientations of the light blade; and a lightsource thermally coupled to the predetermined location on an exteriorportion of the sealed body.
 12. The system of claim 1, wherein a lightsource color is changed to provide a visual indicator for apredetermined event.
 13. The system of claim 1, wherein the light sourcecomprises LEDs each with a different color that when combined, have apredetermined bulb color.
 14. The system of claim 1, wherein the colorof the light source is specified using a computer or mobile device suchas a phone, or programmed in advance.
 15. The system of claim 1, whereinthe bulb color is automatically changed based on a mood of the user asdetected by a sensor or sensed from messages and emails recentlytransmitted by a user.
 16. The system of claim 1, comprising a datatransceiver coupled to the LED to communicate and/or transfer data overa wired network, optical network, or wireless network.
 17. The system ofclaim 1, comprising monitoring software for optimizing lightingefficiency or predictive maintenance.